Handbook of 3D integration, Vol. 2.. Technology and applications of 3D integrated circuits
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783527320349
- Extent
-
XXVI S., S. 273 - 773 S.
- Edition
-
1. Aufl.
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
- Bibliographic citation
-
Handbook of 3D integration
- Classification
-
Elektrotechnik, Elektronik
- Event
-
Veröffentlichung
- (where)
-
Weinheim
- (who)
-
Wiley-VCH
- (when)
-
2008
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 1:49 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Wiley-VCH
Time of origin
- 2008
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Handbook of 3D integration, Vol. 3. 3D process technology
Automated system partitioning based on hypergraphs for 3D stacked integrated circuits
Handbook of Digital 3D Reconstruction of Historical Architecture
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Technology of integrated circuits
3D reconstruction of neural circuits from serial EM images
Improved parameter targeting in 3D-integrated superconducting circuits through a polymer spacer process
Simulation of monolithic microwave integrated circuits
Handbook of 3D integration, Vol. 1.. Technology and applications of 3D integrated circuits
Handbook of 3D integration : volumes 1 and 2 ; technology and applications of 3D integrated circuits
Interconnect planning for physical design of 3D integrated circuits
Interconnect Planning for Physical Design of 3D Integrated Circuits
Handbook of 3D integration, Vol. 3. 3D process technology
Automated system partitioning based on hypergraphs for 3D stacked integrated circuits
Handbook of Digital 3D Reconstruction of Historical Architecture
3D nanostructures for quantum photonic circuits
Technology of integrated circuits
3D reconstruction of neural circuits from serial EM images
Improved parameter targeting in 3D-integrated superconducting circuits through a polymer spacer process