Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing ; volume:53 ; number:3 ; day:12 ; month:12 ; year:2023 ; pages:1192-1200 ; date:3.2024
Journal of electronic materials ; 53, Heft 3 (12.12.2023), 1192-1200, 3.2024
- Urheber
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Liang, Shuibao
Jiang, Han
Huang, Jiaqiang
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s11664-023-10853-5
- URN
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urn:nbn:de:101:1-2024041215361757083369
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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14.08.2025, 10:52 MESZ
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Beteiligte
- Liang, Shuibao
- Jiang, Han
- Huang, Jiaqiang
- SpringerLink (Online service)
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