Hochschulschrift
Investigations on the mechanisms of ultrasonic wire bonding
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783959003278
3959003277
- Maße
-
21 cm
- Umfang
-
XI, 120 Seiten
- Sprache
-
Englisch
- Anmerkungen
-
Illustrationen
Gottfried Wilhelm Leibniz Universität Hannover, Dissertation, 2019
- Erschienen in
-
Berichte aus dem IDS / Gottfried Wilhelm Leibniz Universität Hannover ; 2019, Band 03
- Klassifikation
-
Elektrotechnik, Elektronik
- Ereignis
-
Veröffentlichung
- (wo)
-
Garbsen
- (wer)
-
TEWISS
- (wann)
-
2019
- Urheber
- Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 14:05 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Objekttyp
- Hochschulschrift
Beteiligte
Entstanden
- 2019
Ähnliche Objekte (12)
Investigations on the mechanisms of ultrasonic wire bonding : Untersuchungen zu den Mechanismen des Ultraschall-Drahtbondens
Impact of surface texture on ultrasonic wire bonding process
Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
Enhanced process development by simulation of ultrasonic heavy wire bonding
Enhanced process development by simulation of ultrasonic heavy wire bonding
Adaptive prozessintegrierte Qualitätsüberwachung von Ultraschalldrahtbondprozessen : = Adaptive process integrated quality control for ultrasonic wire bonding processes
Computational investigations of reaction mechanisms - pnicogen bonding, bisboronates and radical philicities in organic transformations
Copper metallization on silicon power devices for heavy copper wire-bonding
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Investigation of laser wire bonding for the fabrication of tensegrity structures
Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire
Investigations on the mechanisms of ultrasonic wire bonding : Untersuchungen zu den Mechanismen des Ultraschall-Drahtbondens
Impact of surface texture on ultrasonic wire bonding process
Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
Enhanced process development by simulation of ultrasonic heavy wire bonding
Enhanced process development by simulation of ultrasonic heavy wire bonding
Adaptive prozessintegrierte Qualitätsüberwachung von Ultraschalldrahtbondprozessen : = Adaptive process integrated quality control for ultrasonic wire bonding processes
Computational investigations of reaction mechanisms - pnicogen bonding, bisboronates and radical philicities in organic transformations
Copper metallization on silicon power devices for heavy copper wire-bonding
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Investigation of laser wire bonding for the fabrication of tensegrity structures
Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire
Investigations on the mechanisms of ultrasonic wire bonding : Untersuchungen zu den Mechanismen des Ultraschall-Drahtbondens
Impact of surface texture on ultrasonic wire bonding process
Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
Enhanced process development by simulation of ultrasonic heavy wire bonding
Enhanced process development by simulation of ultrasonic heavy wire bonding
Adaptive prozessintegrierte Qualitätsüberwachung von Ultraschalldrahtbondprozessen : = Adaptive process integrated quality control for ultrasonic wire bonding processes
Computational investigations of reaction mechanisms - pnicogen bonding, bisboronates and radical philicities in organic transformations
Copper metallization on silicon power devices for heavy copper wire-bonding
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Investigation of laser wire bonding for the fabrication of tensegrity structures