Hochschulschrift
Development of advanced endpoint detection and process control for chemical mechanical polishing (CMP) in VLSI circuit fabrication
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783826578052
3826578058
- Dimensions
-
21 cm
- Extent
-
VI, 119 S.
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
Zugl.: Dresden, Techn. Univ., Diss., 2000
- Keyword
-
VLSI
Chemisches Polieren
Inprozesskontrolle
- Event
-
Veröffentlichung
- (where)
-
Aachen
- (who)
-
Shaker
- (when)
-
2000
- Creator
-
Springer, Götz
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 1:47 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
- Springer, Götz
- Shaker
Time of origin
- 2000
Other Objects (12)
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"CMP GIESING
Funktion von cCMP und cCMP-spezifischen Signalwegen
Brass-polishing.
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Layout problems in VLSI circuit design
Algorithms for Circuit Sizing in VLSI Design
Agent based diagnostic system for the defect analysis during chemical mechanical polishing (CMP)
"CMP"
CMP
CMP JB
...CmP
cmP
"CMP GIESING
Funktion von cCMP und cCMP-spezifischen Signalwegen
Brass-polishing.
VLSI-Systeme
Layout problems in VLSI circuit design
Algorithms for Circuit Sizing in VLSI Design
Agent based diagnostic system for the defect analysis during chemical mechanical polishing (CMP)
"CMP"
CMP
CMP JB
...CmP
cmP
"CMP GIESING
Funktion von cCMP und cCMP-spezifischen Signalwegen
Brass-polishing.