Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

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Location: Deutsche Nationalbibliothek Frankfurt am Main

ISSN: 2045-2322

Extent: Online-Ressource

Language: Englisch

Notes: online resource.

Bibliographic citation: Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding ; volume:8 ; number:1 ; day:13 ; month:7 ; year:2018 ; pages:1-7 ; date:12.2018
Scientific reports ; 8, Heft 1 (13.7.2018), 1-7, 12.2018

Classification: Öffentliche Darbietungen, Film, Rundfunk

Creator: Tseng, Chih-Han

Contributor: Tu, K. N.
Chen, Chih
SpringerLink (Online service)

DOI: 10.1038/s41598-018-28812-0

URN: urn:nbn:de:101:1-2018091322594716585657

Rights: Der Zugriff auf das Objekt ist unbeschränkt möglich.

Last update: 15.08.2025, 7:35 AM CEST

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Tseng, Chih-Han
Tu, K. N.
Chen, Chih
SpringerLink (Online service)

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Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

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