Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist

to connected objects

Location: Deutsche Nationalbibliothek Frankfurt am Main

Extent: Online-Ressource

Language: Englisch

Bibliographic citation: In: Micromachines 12 (2021), No. 856

Event: Veröffentlichung

(where): Stuttgart

(who): Universitätsbibliothek der Universität Stuttgart

(when): 2021

Creator: Janek, Florian
Eichhorn, Nadine
Weser, Sascha
Gläser, Kerstin
Eberhardt, Wolfgang
Zimmermann, André

DOI: 10.18419/opus-11603

URN: urn:nbn:de:bsz:93-opus-ds-116202

Rights: Der Zugriff auf das Objekt ist unbeschränkt möglich.

Last update: 25.03.2025, 1:45 PM CET

Data provider

This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.

Show original at data provider

Associated

Janek, Florian
Eichhorn, Nadine
Weser, Sascha
Gläser, Kerstin
Eberhardt, Wolfgang
Zimmermann, André
Universitätsbibliothek der Universität Stuttgart

Time of origin

2021

Other Objects (12)

Hochschulschrift

Ultra-thin chip embedding and interconnect technology for system-in-foil applications

Hochschulschrift

Integration of ultrathin silicon chips

Hochschulschrift

Polymer embedding for ultrathin slicing and optical nanoscopy of thick fluorescent samples

Feasibility study of an automated assembly process for ultrathin chips

Hochschulschrift

Bending-stress management by stacking of ultrathin integrated circuit chips

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Graffiti | Streetart

MASK

Graffiti | Streetart

MASK

Hochschulschrift

Ultra-thin chip embedding and interconnect technology for system-in-foil applications

Hochschulschrift

Integration of ultrathin silicon chips

Hochschulschrift

Polymer embedding for ultrathin slicing and optical nanoscopy of thick fluorescent samples

Feasibility study of an automated assembly process for ultrathin chips

Hochschulschrift

Bending-stress management by stacking of ultrathin integrated circuit chips

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Graffiti | Streetart

MASK

Graffiti | Streetart

MASK

Hochschulschrift

Ultra-thin chip embedding and interconnect technology for system-in-foil applications

Hochschulschrift

Integration of ultrathin silicon chips

Hochschulschrift

Polymer embedding for ultrathin slicing and optical nanoscopy of thick fluorescent samples

Feasibility study of an automated assembly process for ultrathin chips

Hochschulschrift

Bending-stress management by stacking of ultrathin integrated circuit chips

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Standfoto

Planet B: Mask Under Mask

Graffiti | Streetart

MASK

Graffiti | Streetart

MASK

Cultural heritage institutions wishing to register will find more information here.

Fields marked * need to be filled in.

Username*

Please enter your username

Email*

Please enter your email address

Please do not fill this field

First name

Last name

Password*

Please enter your password

Confirm password*

Please enter the same password

I have read the terms of use and the privacy policy for the collection of personal data and accept them. *

This field is required.

I would like to subscribe to the newsletter of the Deutsche Digitale Bibliothek. See newsletter subscription info.

Account created

Your "My DDB" account has been successfully created. Before you can log in to your account, you must click the confirmation link in the message we just sent to the email address you provided.

Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist

Object Details

References and Relationships

Contributors, Places and Time

Further information

Data provider

Associated

Time of origin

Other Objects (12)

Ultra-thin chip embedding and interconnect technology for system-in-foil applications

Integration of ultrathin silicon chips

Polymer embedding for ultrathin slicing and optical nanoscopy of thick fluorescent samples

Feasibility study of an automated assembly process for ultrathin chips

Bending-stress management by stacking of ultrathin integrated circuit chips

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

MASK

MASK

Ultra-thin chip embedding and interconnect technology for system-in-foil applications

Integration of ultrathin silicon chips

Polymer embedding for ultrathin slicing and optical nanoscopy of thick fluorescent samples

Feasibility study of an automated assembly process for ultrathin chips

Bending-stress management by stacking of ultrathin integrated circuit chips

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

MASK

MASK

Ultra-thin chip embedding and interconnect technology for system-in-foil applications

Integration of ultrathin silicon chips

Polymer embedding for ultrathin slicing and optical nanoscopy of thick fluorescent samples

Feasibility study of an automated assembly process for ultrathin chips

Bending-stress management by stacking of ultrathin integrated circuit chips

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

Planet B: Mask Under Mask

MASK

MASK

Related objects

Reset password