Efficient three-component coupling catalysed by mesoporous copper-aluminum based nanocomposites
- Sprache
-
Englisch
- Umfang
-
Online-Ressource
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Erschienen in
-
In: Green Chemistry 2013, 15(5); https://doi.org/10.1039/c3gc36607c
- Urheber
-
Dulle, Jana
Thirunavukkarasu, K.
Mittelmeijer-Hazeleger, Marjo C.
Andreeva, Daria V.
Shiju, N. Raveendran
Rothenberg, Gadi
- Ereignis
-
Veröffentlichung
- (wo)
-
Bayreuth
- (wer)
-
Universität Bayreuth
- (wann)
-
2013
- DOI
-
doi:10.1039/c3gc36607c
- URN
-
urn:nbn:de:bvb:703-epub-4727-9
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:53 MEZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Dulle, Jana
- Thirunavukkarasu, K.
- Mittelmeijer-Hazeleger, Marjo C.
- Andreeva, Daria V.
- Shiju, N. Raveendran
- Rothenberg, Gadi
- Universität Bayreuth
Entstanden
- 2013
Ähnliche Objekte (12)
Catalytic Behaviour of Mesoporous Cobalt-Aluminum Oxides for CO Oxidation
One-Pot Synthesis of Copper Iodide-Polypyrrole Nanocomposites
Trisoxazolines : synthesis and application in enantioselective palladium- and copper-catalysed reactions
Using alcohols as simple H2-equivalents for copper-catalysed transfer semihydrogenations of alkynes
Mass selected copper clusters on well-ordered aluminum oxide layers
Ligand-free copper(I) oxide nanoparticle-catalysed amination of aryl halides in ionic liquids
Micro- and mesoporous polymer-derived ceramic nanocomposites with tailored functionalities for energy and environmental applications
Adhesion mechanism between laser sputtered materials, Copper and Aluminum on Silicon substrate
Night Trading with Futures in China: The Case of Aluminum and Copper
Numerical simulation of laser beam welding for aluminum-copper dissimilar material connections
Adhesion mechanism between laser sputtered materials, Copper and Aluminum on Silicon substrate
Nanocomposites
Catalytic Behaviour of Mesoporous Cobalt-Aluminum Oxides for CO Oxidation
One-Pot Synthesis of Copper Iodide-Polypyrrole Nanocomposites
Trisoxazolines : synthesis and application in enantioselective palladium- and copper-catalysed reactions
Using alcohols as simple H2-equivalents for copper-catalysed transfer semihydrogenations of alkynes
Mass selected copper clusters on well-ordered aluminum oxide layers
Ligand-free copper(I) oxide nanoparticle-catalysed amination of aryl halides in ionic liquids
Micro- and mesoporous polymer-derived ceramic nanocomposites with tailored functionalities for energy and environmental applications
Adhesion mechanism between laser sputtered materials, Copper and Aluminum on Silicon substrate
Night Trading with Futures in China: The Case of Aluminum and Copper
Numerical simulation of laser beam welding for aluminum-copper dissimilar material connections
Adhesion mechanism between laser sputtered materials, Copper and Aluminum on Silicon substrate
Nanocomposites
Catalytic Behaviour of Mesoporous Cobalt-Aluminum Oxides for CO Oxidation
One-Pot Synthesis of Copper Iodide-Polypyrrole Nanocomposites
Trisoxazolines : synthesis and application in enantioselective palladium- and copper-catalysed reactions
Using alcohols as simple H2-equivalents for copper-catalysed transfer semihydrogenations of alkynes
Mass selected copper clusters on well-ordered aluminum oxide layers
Ligand-free copper(I) oxide nanoparticle-catalysed amination of aryl halides in ionic liquids
Micro- and mesoporous polymer-derived ceramic nanocomposites with tailored functionalities for energy and environmental applications
Adhesion mechanism between laser sputtered materials, Copper and Aluminum on Silicon substrate
Night Trading with Futures in China: The Case of Aluminum and Copper
Numerical simulation of laser beam welding for aluminum-copper dissimilar material connections
Adhesion mechanism between laser sputtered materials, Copper and Aluminum on Silicon substrate