Hochschulschrift
Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices : = Dünne Schichten von Kupferoxid und Kupfer hergestellt mittels Atomlagenabscheidung zur Anwendung in Metallisierungssystemen mikroelektronischer Bauelemente
- Weitere Titel
-
Dünne Schichten von Kupferoxid und Kupfer hergestellt mittels Atomlagenabscheidung zur Anwendung in Metallisierungssystemen mikroelektronischer Bauelemente
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
Chemnitz, Techn. Univ., Diss., 2010
- Schlagwort
-
Kupfer
Kupferoxide
Dünne Schicht
Atomlagenabscheidung
Metallisieren
Ameisensäure
Atomschichtepitaxie
Ausgangsmaterial
Diketonate
Galvanische Abscheidung
Kupfer
Kupferoxide
Metallisierungsschicht
Reduktion
Ruthenium
- Urheber
- URN
-
urn:nbn:de:bsz:ch1-201000725
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
15.08.2025, 07:32 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Objekttyp
- Hochschulschrift
Beteiligte
Ähnliche Objekte (12)
New Precursors for CVD Copper Metallization
Copper metallization on silicon power devices for heavy copper wire-bonding
Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices
ALD of Copper and Copper Oxide Thin Films For Applications in Metallization Systems of ULSI Devices
Polymer Metallization by Cold Spray Deposition of Polyamide-Copper Composite Coatings
Electrical characterization of electrochemically grown single copper nanowires
Analysis of Thermally Grown Oxides on Microperforated Copper Sheets
Plated copper front side metallization on printed seed-layers for silicon solar cells
Plated copper front side metallization on printed seed-layers for silicon solar cells
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization
Size‐Dependency of Electrochemically Grown Copper Nanoclusters Derived from Single Copper Atoms for the CO Reduction Reaction
Color of Copper/Copper Oxide
New Precursors for CVD Copper Metallization
Copper metallization on silicon power devices for heavy copper wire-bonding
Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices
ALD of Copper and Copper Oxide Thin Films For Applications in Metallization Systems of ULSI Devices
Polymer Metallization by Cold Spray Deposition of Polyamide-Copper Composite Coatings
Electrical characterization of electrochemically grown single copper nanowires
Analysis of Thermally Grown Oxides on Microperforated Copper Sheets
Plated copper front side metallization on printed seed-layers for silicon solar cells
Plated copper front side metallization on printed seed-layers for silicon solar cells
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization
Size‐Dependency of Electrochemically Grown Copper Nanoclusters Derived from Single Copper Atoms for the CO Reduction Reaction
Color of Copper/Copper Oxide
New Precursors for CVD Copper Metallization
Copper metallization on silicon power devices for heavy copper wire-bonding
Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices
ALD of Copper and Copper Oxide Thin Films For Applications in Metallization Systems of ULSI Devices
Polymer Metallization by Cold Spray Deposition of Polyamide-Copper Composite Coatings
Electrical characterization of electrochemically grown single copper nanowires
Analysis of Thermally Grown Oxides on Microperforated Copper Sheets
Plated copper front side metallization on printed seed-layers for silicon solar cells
Plated copper front side metallization on printed seed-layers for silicon solar cells
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization
Size‐Dependency of Electrochemically Grown Copper Nanoclusters Derived from Single Copper Atoms for the CO Reduction Reaction