Hochschulschrift
Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Dimensions
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30 cn
- Extent
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xv, 238 Seiten
- Language
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Englisch
- Notes
-
Illustrationen
Technische Universität Berlin, Dissertation, 2020
- Classification
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Elektrotechnik, Elektronik
- Keyword
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Hochschulschrift
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
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11.06.2025, 2:01 PM CEST
Data provider
This object is provided by:
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Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
Time of origin
- 2020
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