A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulation
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Erschienen in
-
In: IEEE access 7 (2019), pp. 56163-56173
- Ereignis
-
Veröffentlichung
- (wo)
-
Stuttgart
- (wer)
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Universitätsbibliothek der Universität Stuttgart
- (wann)
-
2019
- Urheber
- DOI
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10.18419/opus-11226
- URN
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urn:nbn:de:bsz:93-opus-ds-112431
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
15.08.2025, 07:31 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Soltani, Mahdi
- Kulkarni, Romit
- Scheinost, Tobias
- Groezinger, Tobias
- Zimmermann, André
- Universitätsbibliothek der Universität Stuttgart
Entstanden
- 2019
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