Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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Online-Ressource, 1 online resource.
- Sprache
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Englisch
- Erschienen in
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Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy ; volume:32 ; number:13 ; day:22 ; month:5 ; year:2023 ; pages:5749-5755 ; date:7.2023
Journal of materials engineering and performance ; 32, Heft 13 (22.5.2023), 5749-5755, 7.2023
- Urheber
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Czaja, Paweł
Dybeł, Aleksandra
Pstruś, Janusz
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s11665-023-08284-8
- URN
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urn:nbn:de:101:1-2023100408425419654875
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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14.08.2025, 11:01 MESZ
Datenpartner
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Beteiligte
- Czaja, Paweł
- Dybeł, Aleksandra
- Pstruś, Janusz
- SpringerLink (Online service)
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